packaging

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

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SK hynix is said to be testing Intel’s 2.5D packaging for HBM integration.

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Open source devs consider making [bandwidth] hogs pay for every download

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note to mods: this is an opinion article, but it contains a lot of newsworthy statistics and prose on Maven (Java ecosystem package repository) being used as a CDN

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