Intel Foundry Combines GaN and Silicon Semiconductors on a Single Thin Chip

Intel Foundry has been delivering some interesting research lately, and the newest installment is the world’s thinnest gallium nitride (GaN) chiplet, with the base silicon measuring just 19 micrometers in thickness. The company manufactured a 300-millimeter GaN-on-silicon wafer, which is one of the first combinations of GaN with traditional silicon logic on a single chip. In traditional manufacturing setups, GaN is reserved for power electronics and is not mixed with silicon-based computational logic. However, Intel has managed to combine GaN semiconductors for power delivery with silicon-based compute logic, meaning that power chips can now perform basic computations and actions on their own, without needing a separate chip to dictate behavior.